Method of manufacturing a semiconductor light emitting device

ABSTRACT

A semiconductor light emitting device able to emit a high intensity, stable light. An edge surface lighting type light emitting diode array is formed on a substrate. A light emitting edge surface of each light emitting element is formed by an etching method. A surface of the substrate in front of the light emitting edge surface is formed in multiple stage so that a light beam is not reflected by the surface of the substrate.

This is a division of application Ser. No. 07/917,851 filed Jul. 21,1992 now U.S. Pat. No. 5,294,815.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor light emitting deviceused as a light source of an image forming apparatus or an opticalprinter and a manufacturing method thereof. More particularly thepresent invention relates to a semiconductor light emitting device whichcomprises a light emitting diode array and a manufacturing methodthereof.

Recently, a light emitting diode array used for a light source of anoptical printer or an image forming apparatus using an electrographicprocess has been studied. This light emitting diode array, whichcomprises self light-emission type array elements, emits light inaccordance with an image signal. The light is applied to aphotoconductor via an equal multiplication image forming element to forman electrostatic latent image. The latent image is processed bydevelopment, transfer, and fixing, and eventually a printing process iscompleted by an electrographic method.

A light emitting board 101, included in an optical printer using aconventional light emitting diode array, comprises, as shown in FIG. 1,a base board 102 that serves as a heat sink, and circuit members 103,104,105 adhered to the base board 102. Cables 106,107 are connected tothe circuit members 103,104,105 in order to supply an electric powersource and to supply an image signal. Reference numerals 108₋₁ ˜108_(-n)indicate aligned light emitting diode array chips, and referencenumerals 109₋₁ ˜109_(-n) and 110₋₁ ˜110_(-n) indicate driver circuitsthat drive the light emitting diode array chips 108₋₁ ˜108_(-n). Each ofthe chips is a driving IC for light emitting diodes incorporated with aserial/parallel converter for an image signal supplied from the cable106,107.

In the above mentioned light emitting board 101, image signals for asingle line are appropriately supplied to the driver circuits 109₋₁˜109_(-n) and 110₋₁ ˜110_(-n). After the data for the entire portion ofthe single line is supplied to the driver circuits, the data is suppliedto the drive terminals of the light emitting diodes. According to thedata, each light emitting diode turns on and off and image forminglighting points are generated for one single line.

As shown in FIG. 2, a light emitted from a light emitting diode201_(-m-p), of each light emitting diode 201_(-m) is projected onto aphotoconducting drum 203 via an equal multiplication image formingsystem 202 such as a SELFOC lens array or a RMLA (roof mirror lensarray).

The size of an optical printer head using such a light emitting diodearray can be minimized because there are no moving parts and it has areduced number of component parts. Additionally, since the lightemitting diode is a self lighting type and has a high quenching ratio, ahigh contrast image is obtained. Further advantages can also beobtained, such as a possibility of making a longer array by connecting anumber of chips, and a possibility of making a high speed array byincreasing an output of the light emitting diodes.

There are two different type of light emitting diodes used for opticalprinter heads. One is a plane surface lighting type light emitting diodearray which comprises a number of light emitting portions, having asquare face for example, arranged in a plane parallel to a base board.The other is an edge surface lighting type light emitting diode arraywhich emits a light from an edge surface perpendicular to a planesurface of a base board.

An example of the basic construction of a plane surface lighting typelight emitting diode array, shown in FIG. 3, is suggested in thepreliminary draft of the 1980 session of the institute of Electronicsand Communication Engineers of Japan. In this plane surface lightingtype light emitting diode array, electrodes 121 are formed on both sidesof, or around the light emitting portion 120 so that intensity of thelight from the light emitting portion 120 becomes uniform in a lightemitting plane. However, in this construction, a width of each elementbecomes a sum of a width of the light emitting portion 120, a width ofthe electrode 121, and a width of the separation area between theelements.

Thus, forming of a high density light emitting portion, for example morethan 600 dpi (dots per inch), is extremely difficult.

An example of the basic construction of an edge surface lighting typelight emitting diode array, shown in FIG. 4, is suggested in JapaneseLaid-Open Patent Application No. 60-32373. In this example, a pluralityof light emitting portions 122 are formed within a layered constructionon a base board. These light emitting portions 122 are electrically andphysically separated by separation grooves formed to be perpendicular toa surface of the base board. As shown in FIG. 4, the light emittingportions 122 and the electrodes 124,125 are not placed in the sameplane, thus a with of each element is a sum of a width of a lightemitting portion 122 and a width of the separation area between theelements. Thus, forming of a high density light emitting portion, forexample more than 600 dpi (dots per inch), is possible.

Therefore, it is said that an edge surface lighting type light emittingdiode array is suitable for a light emitting diode array used as a highdensity light source for optical printers. With respect to a dispersionof light emitted from each light emitting diode in a light emittingdiode array, a good uniformity of a thickness of a crystal layer anduniformity of an electrical and an optical characteristics of a film ina base board have been achieved by the recent progress of technology incrystal growth of compound semiconductors. Accordingly, it has becomepossible to have a dispersion of light emitted from each light emittingdiode of a light emitting diode array on the same chip falls within ±5%.

In a light emitting device using the above mentioned light emittingdiode array, differences in intensity of light are produced betweenchips due to the non-uniformity of mounting which results in anon-uniformity of heat radiation, and electrode forming means forproducing a characteristic of crystal layer of a compound semiconductorwhich comprises the light emitting diode array. This results in largedifferences in contrast or size of dots when used as a light source ofan optical printer.

Particularly, in the conventional edge surface lighting type lightemitting diode array, as shown in FIG. 4, a light emitting edge surfaceis formed by cleaving. Producing the light emitting edge surface bycleaving results in various shapes of the light emitting edge surfacebecause the cleaving itself is not a well established technology.Accordingly, differences are produced of scattering and absorbing of thelight at the light emitting surface. These differences result in lack ofuniformity in the intensity of lights emitted from the light emittingdiode array. Since the light emitting edge surface is formed bycleaving, the light emitting edge surface inevitably becomes an edge ofthe base board. Accordingly, the light emitting surface is easilydamaged while handling the light emitting diode array for mounting; thusthere are problems in that uniformity of intensity of the light isfurther reduced and in that the yield of production is low.

As a rudimentary way of eliminating the above mentioned disadvantages,as shown in FIG. 5, it has been considered to form a light emitting edgesurface by a method other than cleaving, and to form a terrace 29 underthe light emitting edge surface. In this way, the light emitting edgesurface can be formed with a uniform shape because the light emittingedge surface is formed by the same separation grooves between elementsare formed; the terrace 29, which allows the light emitting edge surfaceto not become an edge of the base board, is also formed together withthe grooves. Therefore, uniformity in the intensity of lights isobtained and yield of production can be increased.

In case a light emitting diode array is used as a light source of anoptical printer, as shown in FIG. 2, a light emitted from a lightemitting diode 201_(-m-p) is focused on a surface of a photoconductingdrum 203 via an equal multiplication image forming system 202. In suchan optical system, an angle Θ from a center axis of a light beam havingpassed through a lens, to an edge of said light beam (=arctan(φ/2s): φis an effective diameter of the lens, S is a distance of an object) isimportant. That is, a number of openings of an equal multiplicationimage forming element (N.A.=n·sin Θ: n is an index of reflection of themedium) is determined by considering MTF (a spatial frequency of thelens). In case an diverging angle θ from the center axis of a light beamemanating from a light emitting diode to an edge of the light beam islarger than Θ, an efficiency of utilizing light is decreased due to thebeam not being able to enter into the equal multiplication image formingelement. Therefore, an effort has been made to decrease the angle θ.

Generally, it is known that the diverging angle θ, from a center axis ofthe beam emitted from an edge surface lighting type light emitting diodeto an edge of the light beam is smaller than that of the plane surfacelighting type because, in an edge surface lighting type light emittingdiode, light emission from near an edge surface mainly contributes tothe intensity of light in contrast to emission from an inner side.

According to the results of experimental work by the. present applicant,an angle 2θ, from edge to edge of a width of a light beam of an edgesurface lighting type light emitting diode was measured as 30°˜100 °,while that of a plane surface lighting type was measured asapproximately 120 °. It is assured that making an element having anangle of light beam within this angle range is possible.

When simultaneously forming a light emitting edge surface and separationgrooves between adjacent elements on a light emitting diode, a shape ofa base board in front of a light emitting edge surface is to be designedso as to satisfy the following equation (1):

    Lx<Lz/tan θ                                          (1)

where the parameters of the above equation (1), shown in FIG. 5, are:

Lz: a depth from a light emitting layer 23 to a terrace surface 29a

Lx: a length between a light emitting edge surface and a terrace edge 1a

θ: a diverging angle of light beam emitted from a light emitting edgesurface.

As far as the elevation angle θ is concerned, no problem may arise ifthe equation (1) is not satisfied. Concerning the depression angle θ, asshown in FIG. 7A, if a length Lx between a light emitting edge surfaceand an edge of the base board (an edge of a terrace 1) is too long, alight beam emitted from the light emitting edge surface is reflected bythe top surface of the terrace 29 and the reflected light beam proceedsin a direction of the elevation angle θ. As a result, the angle 2θincreases because of interference of the light beam emitted in thedirection of the elevation angle θ with the light beam reflected by theterrace surface 29a; thus the angle 2θ becomes larger than the angle 2Θof an equal multiplication image forming element, thus reducing anefficiency of utilization of light.

When Lz is too short, as shown in FIG. 7B, or when the angle θ is toolarge, as shown in FIG. 7C, the same phenomena occurs and efficiency ofutilization of light is decreased. Accordingly, it is very important todesign the base board in front of the light emitting edge surface of anedge surface lighting type light emitting diode array so as to satisfythe equation (1) so that the angle θ is effectively controlled withrespect to the angle Θ of the equal multiplication image formingelement.

When the base board in front of the light emitting edge surface of anedge surface lighting type light emitting diode array is made based on adesign satisfying the equation (1), there still remain the followingproblems in production. In a conventional production process of acompound semiconductor element, usually a 2 inch single crystal wafer isused, and light emitting devices such as the above mentioned edgesurface lighting type light emitting diode array are produced byefficiently arranging a plurality of arrays on the wafer, as shown inFIG. 6. Each of the light emitting diode arrays are then cut away alongan inscribed line 30 by cleaving technology or dicing technology.

Therefore, accuracy in cutting the wafer is an important factor forsatisfying the equation (1). However, as cleaving is not yet anestablished technology, it is difficult to obtain good accuracy forforming the Lx. Although dicing technology is a more stable technologythan cleaving technology, the wafer tends to chip due to the highrotation speed of a disc blade, as high as 30,000 rpm, used to cut thewafer; thus it is difficult to obtain good accuracy without defects inthe cut away chip.

Table 1 shows the results of calculations in accordance with theequation Lx=Lz/tan θ;θ=15° and 50°.

                  TABLE 1                                                         ______________________________________                                        θ                                                                           15°         50°                                             ______________________________________                                        Lz  1.0    2.7     5.0   10.0  1.0  5.0  10.0  12.0                           Lx  3.7    10.0    18.6  37.3  0.8  4.1  8.3   10.0                           (μm)                                                                       ______________________________________                                    

By means of the table 1, it is understood, for example, the case theangle θ is 15° and the depth Lz is 1 μm; the reflection at a terrace canbe prevented by having an Lx of 3.7 μm. Similarly, when the angle θ is50°, Lx is to be 0.8 μm with an Lz of 1 μm. Accordingly, high accuracyis required when cutting the wafer with respect to the size of Lx.

According to an experiment by the present applicant, Lx can be formed asshort as approximately 10 μm, by using dicing technology. When Lx is 10μm and the angle θ is 50°, Lz needs to be more than 12 μm. However,etching of 12 μm requires a long process time (approx. 10 min./μm) thatresults in an increase in the manufacturing costs. Additionally, thereis a problem in that if a step between a light emitting element and ametal lead pattern portion is more than 12 μm, the metal lead tends tobe easily cut. Therefore, it is preferable to limit techniques to theforming of Lz , but rather to investigate other methods of solving thisproblem.

On the other hand, in case Lx=10 μm and the angle θ is 15°, the dryetching process does not take a long time because Lz is required to beonly 2.7 μm. The angle θ is controlled in accordance with epitaxialgrowth technology, such as the MOCVD method, for forming of layers of anelement structure. However, to achieve a condition where the angle θ isless than 15 °, all of the edge surface lighting type light emittingdiode arrays on a wafer (on the entirety of the 2 inch wafer) arerequired to be formed so as to satisfy optically transmissibleconditions and a thickness of an active layer has to be uniformly lessthan 500 Å. The technique for realizing the angle θ of less than 15° hasbeen achieved experimentally, however, it is difficult to introduce thetechnique into mass production.

SUMMARY OF THE INVENTION

It is a general object of the present invention to provide a novel andimproved semiconductor light emitting device, in which the abovementioned disadvantages are eliminated, and a manufacturing methodthereof.

A more specific object of the present invention is to providea-semiconductor light emitting device in which a high density lightemitting portion and a uniformity of intensity of light can be obtained,so that a high density and high quality printing can be realized byusing such a device, and an effective manufacturing method thereof.

In order to achieve the above mentioned object, a semiconductor lightemitting device of the present invention comprises:

a substrate on which a light emitting diode is to be formed;

a light emitting diode comprising a layered structure formed on thesubstrate, having at least a light emitting layer and electrodespositioned on both sides of the light emitting layer, and having a lightemitting edge surface perpendicular to a plane of the light emittinglayer; and

a plurality of grooves separating the light emitting diode into aplurality of light emitting diode elements;

the substrate including a first surface parallel to a center axis of alight beam emitted from the light emitting diode element, a secondsurface having a step and being parallel to the first surface, a firstterrace edge formed between the first and second surfaces, and a secondterrace edge formed on the edge of the substrate;

the first and second surfaces are formed so as to satisfy the followingtwo equations;

    Lx.sub.1 <Lz.sub.1 /tan θ

    Lx.sub.2 <Lz.sub.2 /tan θ

where:

Lx₁ is a distance between the light emitting edge surface and the firstterrace edge;

Lx₂ is a distance between the light emitting edge surface and the secondterrace edge;

Lz₁ is a distance between the light emitting layer and the firstsurface;

Lz₂ is a distance between the light emitting layer and the secondsurface;

θ is a diverging angle of the light beam emitted from the light emittingdiode elements from the center axis to the surface of the substrate.

A manufacturing method of a semiconductor light emitting device of thepresent invention comprises:

forming a plurality of light emitting diodes comprising a layeredstructure formed on a substrate and having at least a light emittinglayer and electrodes on both sides of the light emitting layer;

separating said light emitting diode into a plurality of light emittingdiode elements by forming a plurality of separation grooves, and forminga first surface parallel to a center axis of a light beam emitted fromthe light emitting diode elements and forming by an etching method alight emitting edge surface perpendicular to the surface of thesubstrate;

applying a masking onto a predetermined portion of the first surface;

forming by an etching method a second surface having a step and parallelto the first surface, a first terrace edge is simultaneously formedbetween the first and second surfaces; and

separating each of the plurality of light emitting diodes, so that asecond terrace edge is formed on the edge of the substrate;

the first and second surfaces are formed so as to satisfy the followingtwo equations;

    Lx.sub.1 <Lz.sub.1 /tan θ

    Lx.sub.2 <Lz.sub.2 /tan θ

where:

Lx₁ is a distance between the light emitting edge surface and the firstterrace edge;

Lx₂ is a distance between the light emitting edge surface and the secondterrace edge;

Lz₁ is a distance between the light emitting layer and the firstsurface;

Lz₂ is a distance between the light emitting layer and the secondsurface;

θ is a diverging angle of the light beam emitted from the light emittingdiode elements from the center axis to the surface of the substrate.

According to the present invention, by using a method other thancleaving, such as a dry etching method, for forming a light emittingedge surface, a high density light emitting portion can be formed. Sincethe light emitting edge surface can be formed with uniform shape,uniformity of intensity of light can be obtained. Further, because thelight emitting edge surface is formed in a portion that is recessed fromthe edge of the substrate, the light emitting edge surface can beprotected from damage caused by handling while mounting.

Other objects, features and advantages of the present invention willbecome more apparent from the following detailed description when readin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an elevational view of a light emitting board which isincluded in a printing head using a conventional light emitting diodearray;

FIG. 2 is a schematic illustration for explaining a relationship betweena light emitting portion of a light emitting diode array and an imageformed on a surface of a photoconductor;

FIG. 3 is a plane view of a conventional plane surface lighting typelight emitting diode array;

FIG. 4 is an elevational view of a conventional edge surface lightingtype light emitting diode array;

FIG. 5 is a schematic cross sectional view of an array for explaining aprinciple of the present invention;

FIG. 6 is an elevational view of a group of light emitting diode arraysformed on a single crystal wafer.

FIG. 7 is a schematic cross sectional view of an array for explaining aprinciple of the present invention; FIG. 7A showing the paths of lightbeams when a length of a terrace Lx is too long; FIG. 7B showing thepaths of light beams when a height of a diode element Lz is too short;FIG. 7C showing the paths of light beams when an angle θ is too large;

FIG. 8 is a plane view of a semiconductor light emitting device of anembodiment of the present invention;

FIG. 9 is a partial elevational view of the semiconductor light emittingdevice of FIG. 8;

FIGS. 10A and B are partial schematic cross sectional views of anembodiment of the present invention; FIG. 10A showing a state after afirst etching process is completed, and FIG. 10B showing a state after asecond etching is completed and cut away;

FIG. 11 is a partial cross sectional view of the semiconductor lightemitting device of FIG. 8 taken along a line XI--XI;

FIG. 12 is a schematic cross sectional view of a variation of theembodiment of the present invention.

FIG. 13A is a graph showing results of measurement of the comparisonsample; and

FIG. 13B is a graph showing results of measurement of the sample of thepresent invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

A description will be given of an embodiment of the present inventionwith reference to FIGS. 8, 9 and 10. FIG. 8 is a plane view of asemiconductor light emitting device of an embodiment of the presentinvention. FIG. 9 is a partial elevational view of the semiconductorlight emitting device of FIG. 8. FIGS. 10A and B are partial schematiccross sectional views of an embodiment of the present invention; FIG.10A showing a state after a first etching process is completed, and FIG.10B showing a state after a second etching is completed and cut away.

In a semiconductor light emitting device of FIG. 8, reference numeral 2(2-1˜2-256) indicates an edge surface lighting type light emitting diodearray. This array 2 (2-1˜2-256) has a dot density of 600 dpi andcomprises 256 elements formed on an n-type GaAs substrate 1. A layeredstructure of the light emitting diode array 2 comprises, as shown inFIG. 9, a plurality of layers formed by the MOVPE method on thesubstrate

(base board) 1. The layers are an n-type buffer layer 21, an n-typeAl₀.4 Ga₀.6 As clad layer 22, a Al₀.2 Ga₀.8 As active layer 23 that is alight emitting layer, a p-type Al₀.4 Ga₀.6 As clad layer 24, p-type GaAscap layer 25, and a p+ type GaAs contact layer 26 doped with zinc inhigh concentration. Since this layered structure includes a so calleddouble-hetero structure, an elevation angle θ and a depression angle θare equal.

A first separation groove 11, provided between a top surface of thecontact layer 26 and a surface of the substrate 1, is formed by a dryetching method using chlorine gas. The light emitting diode elements2-1˜2-256 formed on the substrate 1 are electrically separated by thegroove 11. As shown in FIG. 8, the light emitting edge surfaces 2a oflight emitting diode elements 2-1˜2-256 are formed to be perpendicularto the surface of the substrate 1, and are aligned near to and along aterrace edge 1a of the substrate 1. A terrace 29, best shown in FIG. 9,is formed on the substrate 1 in front of the light emitting edge surfacesimultaneously when forming the groove 11.

Following the forming of a first terrace surface 29a of the terrace 29 amasking is applied, and then a part of the terrace 29 is removed by adry etching method so as to form a second terrace surface 29b, which isstepped down from the first terrace surface 29a. The masking inaccordance with the present invention is applied so that the followingequations are satisfied.

    Lx.sub.1 <Lz.sub.1 /tan θ                            (2)

    Lx.sub.2 <Lz.sub.2 /tan θ                            (3)

Where;

Lx₁ is a distance between the light emitting edge surface and the firstterrace edge 1a;

Lx₂ is a distance between the light emitting edge surface and the edgeof the substrate 1;

Lz₁ is a distance between the light emitting layer 23 and the firstterrace surface 29a;

Lz₂ is a distance between the light emitting layer 23 and the secondterrace surface 29b;

θ is an diverging angle of the light beam emitted from the lightemitting elements 2 from the center axis towards the surface of thesubstrate 1.

A positive electrode 27 made of Au--Zn/Au is formed on the contact layer26 of each element 2-1˜2-256, and a negative electrode 28 made ofAu--Ge/Ni/Au is formed on a back surface of the substrate 1. Thepositive electrodes 27 are respectively connected to bonding pads3-1˜3-256 that are formed on the other side of the surface of thesubstrate 1. Accordingly the elements 2-1˜2-256 are protected fromdamage caused by bonding and thus a decrease of efficiency of lightemission is prevented. These bonding pads 3-1˜3-256 are arranged in fourlines to enable a high density mounting.

It is to be noted that since the light emitting diode array describedabove is produced by the MOVPE method, which enables good uniformity ofa film to be maintained, a dispersion of light intensity in the samearray falls within ±5%.

A more detailed description of the processing of the terrace 29 will begiven below with reference to FIGS. 10A and 10B. The surface 29a of theterrace 29 is simultaneously formed by a first dry etching processduring the formation of the first grooves 11, whose bottom surfacesreach to the original surface of the substrate 1. In this process, asshown in FIG. 10A, the dry etching is executed so that a predeterminedLz₁, which is determined by the equations (2) and (3), is formed. Then,for a second dry etching process to follow, masking is applied on aportion of the terrace 29 so as to form Lx₁ as determined by equation(3). Following the masking process, as shown in FIG. 10B, the second dryetching is applied until a depth of the etching becomes (Lz₂ -Lz₁) Lx₂is to be formed at the time each array is cut away from the wafer.

For example, in case the angle θ is 50° and the value of Lz₁ =2.4 μm,the values of Lx₁ =2 μm, Lz₂ =12 μm, and Lx₂ =10 μm are determined bythe equations (2) and (3). In other words, a depth of the first etchingis to be more than 2.4 μm, a depth of the second etching more than 9.6μm with Lx₁ =2 μm, and the array is to be cut at 10 μm from the lightemitting edge surface. This Lx₂, 10 μm, can be achieved by theconventional cutting technology.

As mentioned above, by using a method other than cleaving, such as a dryetching method, for forming a light emitting edge surface, a highdensity light emitting portion can be formed. Since the light emittingedge surface can be formed with uniform shape, uniformity of lightintensity can be obtained. Further, because the light emitting edgesurface is formed in a portion that is recessed from the edge of thesubstrate, the light emitting edge surface can be protected from damagecaused by handling while mounting.

The light emitting diode array of the present invention further includesa monitoring device 4, shown in FIG. 8, formed on the surface of thesubstrate 1 in a position other than the bonding pads 3-1˜3-256 and thelight emitting diode elements 2-1˜2-256. The monitoring device 4 isprovided for generating signals for monitoring conditions of the lightemitted from the light emitting diode elements 2-1˜2-256.

The monitoring device 4 comprises a layered structure similar to that ofthe light emitting diode elements 2-1˜2-256. As shown in FIG. 11, themonitoring device 4 includes an edge surface lighting type lightemitting diode 5 and a photodiode 6. These diodes 5 and 6 areelectrically and physically separated by a second separation groove 12,which groove is to be formed perpendicular to the surface of thesubstrate 1. One side of the groove 12 comprises a light emitting edgesurface 5a of the light emitting diode 5 and the other side of thegroove 12 comprises an edge surface of the photodiode 6, which surfaceserves as a light sensing portion. With this construction, a light 8,emitted from the edge surface 5a of the light emitting diode 5, isreceived by the edge surface of the photodiode 6, which surface isopposite to the surface 5a, without interference.

The monitoring device 4 is able to monitor the conditions of the lightemitted from the light emitting diode elements 2-1˜2-256 because thestructure of the light emitting diode 5 is the same as that of the lightemitting diode elements 2-1˜2-256. Since the light emitting diode 5 isformed on the surface of the substrate 1 on which the the light emittingdiode elements 2-1˜2-256 are formed,the light emitting diode 5 is in thesame conditions as that of the light emitting diode elements 2-1˜2-256.Accordingly, light supplied to the photodiode 6 has the samefluctuations as light emitted from the light emitting diode elements2-1˜2-256. These fluctuations are generated by changes in ambienttemperature or changes in supplied voltage. Therefore, the monitoringdevice 4 can monitor the conditions of light emitted from the lightemitting diode elements 2-1˜2-256, and thus the light emitting diodearray of this embodiment can supply a stable intensity of light.

It is to be noted that the p-type layer of the light emitting diodeelements 2-1˜2-256, light emitting diode 5 and photodiode 6 can be madeof an n-type, and that the reverse is also true, corresponding n-typescan be made p-types. Further, although the first and second separationgrooves 11 and 12 are formed to be perpendicular to the surface of thesubstrate 1, this perpendicularity of the grooves is not essential aslong as the grooves are not parallel to the surface of the substrate 1,In addition, the bottom surfaces of the grooves 11,12 need notnecessarily reach to the surface of the substrate 1, as long as thegrooves reach to the lower clad layer by penetrating the active layer23, which results in an electrical separation of the each light emittingdiode elements 2-1˜2-256, and diodes 5 and 6.

FIG. 12 is a variation of the above mentioned embodiment. In FIG. 12,those parts that are the same as corresponding parts in FIG. 10 aredesignated by the same reference numerals from figure to figure, anddescriptions thereof will be omitted. A construction of each lightemitting diode elements 2-1˜2-256 and a monitoring device 4 is the sameas in the above mentioned embodiment, but a portion of the substrate 1in front of the light emitting diode elements 2-1˜2-256 is not formedwith two stages but with multiple stages, having m steps, as shown inFIG. 12. The shape of the stages are designed to satisfy the followingequation.

    Lx.sub.n <Lz.sub.n /tan θ                            (4)

Where;

n is an integral number from 1 to m:

Lx_(n) is a distance between the edge surface of the light emittingdiode elements 2-1˜2-256 and the terrace edge of the n-th. stage;

Lz_(n) is a distance between the active layer 23 and the terrace surfaceof the n-th. stage;

θ is a diverging angle of the light beam emitted from the light emittingdiode elements 2-1˜2-256, from the center axis to a direction towardsthe surface of the substrate 1.

As is apparent from the description of the above mentioned embodiment,the stages are formed so that the light emitted from the edge surfacesof the light emitting diode elements 2-1˜2-256 is not reflected by theportion of the substrate 1 in front of the edge surface of the elements2-1˜2-256. The process of forming the multiple stages can be done byrepeating the above mentioned process for two stages.

This variation may be applied to an array which has a relatively longerterrace length in front of the elements 2-1˜2-256. Thus, a more flexibledesign of a light emitting diode array can be obtained.

Following will be given, a description of results of an experiment,performed so as to verify the effects of the above mentioned invention.

A sample used in the experiment has a cross section as shown in FIG.10B. The shape of this substrate sample in front of a light emittingedge surface is formed in two steps as in the embodiment of the presentinvention mentioned above, which embodiment corresponds to an embodimentvariation, having m steps, in a condition where the number of steps istwo.

The method of producing the sample is the same as described with respectto the embodiment of the present invention mentioned above. The angle θof the sample was 15°,and the sample was produced so as to have thevalues of; Lz₁ =2.4 μm, Lx₁ =3.3 μm, Lz₂ =9.0 μm, and Lx₂ =10.0 μm.These values were determined so as to satisfy the equations (2) and (3).In other words, a depth of the first etching Lz₁ was 2.4 μm, a depth ofthe second etching was 9.0 μm, a length of the first terrace surface Lx₁was 3.3 μm, and a distance between the light emitting edge surface andthe cut edge of the substrate Lx₂ was 10.0 μm.

Substituting Lx₁ =3.3 μm, Lz₁ =2.4 μm and angle θ=15° into the equation(2) we obtain:

    3.3<2.4/tan 15°=9.0;

substituting Lx₂ =10.0, Lz₂ =9.0, and angle θ=15° into the equation (3)we obtain:

    10.0<9.0/tan 15°=33.6.

The sample was verified to meet the design of the present invention.

For the purpose of comparison, another light emitting diode wasproduced, which diode does not meet the design of the present invention,as a comparison sample. This comparison sample was produced by onlyperforming the first etching, and the cross section thereof was likethat shown in FIGS. 7A, 7B. The depth of the etching was 2.3 μm and thelength of the terrace was 10.6 μm, which values are approximate to thatof the sample mentioned above, so as to make a simple comparison withthe sample.

The comparison sample corresponds to the variation of the presentinvention mentioned above in the condition where the number of steps mis one. Accordingly, by substituting n=1 in the equation (4), theequation (4) becomes as follows;

    Lx.sub.1 <Lz.sub.1 /tan θ.

In the comparison sample, Lx₁ =10.6 μm and Lz₁ =2.3 μm; with thesevalues, the above equation is not satisfied. The comparison sample wasverified not to meet the design of the present invention.

Then, measurements were taken of the far field pattern for both thesample of the present invention and the comparison sample. FIG. 13A is agraph showing results of measurement of the comparison sample. FIG. 13Bis a graph showing results of measurement of the sample of the presentinvention.

In FIG. 13A, the far field pattern I has a wide side-robe with aplurality of waves in the angle range from 0° to 60 °. This side-robe isconsidered to be the result of interference between the light directlyemitted at an elevational angle and the light reflected from the surfaceof the substrate, as shown in FIGS. 7A,7B.

On the other hand, in FIG. 13B, the far field pattern II has a narrowside-robe without waves in the angle range from 0° to 60°. Thisindicates that higher quality of light emitted from the light emittingdiode of the present invention can be obtained than with the lightemitting diode that does not have steps, as is the case with thecomparison sample.

The present invention is not limited to the specifically disclosedembodiments, and variations and modifications may be made withoutdeparting from the scope of the present invention.

What is claimed is:
 1. A manufacturing method of a light emitting devicewhich comprises:forming a plurality of light emitting diodes comprisinga layered structure formed on a substrate, and having at least a lightemitting layer and electrodes on both sides of the light emitting layer;separating said light emitting diode into a plurality of light emittingdiode elements by forming a plurality of separation grooves, and forminga first surface to be parallel to a center axis of a light beam emittedfrom said light emitting diode elements and forming a light emittingedge surface to be perpendicular to the surface of said substrate by anetching method; applying a masking onto a predetermined portion of saidfirst surface; forming a second surface having a step and so as to beparallel to said first surface, by using an etching method, a firstterrace edge is simultaneously formed between the first and secondsurfaces; and separating each light emitting diode element of saidplurality of light emitting diodes, so that a second terrace edge isformed on the edge of said substrate; said first and second surfaces areformed so as to satisfy the following two equations;

    Lx.sub.1 <Lz.sub.1 /tan θ

    Lx.sub.2 <Lz.sub.2 /tan θ

where: Lx₁ is a distance between said light emitting edge surface andsaid first terrace edge; Lx₂ is a distance between said light emittingedge surface and said second terrace edge; Lz₁ is a distance betweensaid light emitting layer and said first surface; Lz₂ is a distancebetween said light emitting layer and said second surface; θ is adiverging angle of the light beam emitted from said light emitting diodeelements, from the center axis towards the surface of said substrate. 2.The manufacturing method as claimed in claim 1, wherein said methodfurther comprises:forming other light emitting diodes simultaneouslywith said light emitting diodes on the other end of the surface of saidsubstrate on which surface said light emitting diode elements areformed; and forming a monitoring device by separating said other lightemitting diode into two portions by an etching method simultaneouslywith the forming of said separation grooves; one of said other separateddiodes serving as a light emitting element and the other of said otherdiodes serving as a photodiode, so as to output a monitor signalconcerning light emitted from said light emitting diode elements.